Sub-Nanometer Optical Interconnects Eliminate Inter-Cluster Neural Network Latency Bottlenecks
Co-packaged silicon photonics eliminate electrical resistance barriers, enabling petabit-per-second AI cluster interconnects.
Next-generation silicon photonics architectures demonstrate petabit-per-second optical interconnect throughput between neural tensor processing units. The optical packaging eliminates copper resistance thermal throttling and scales distributed GPU clusters linearly.


